BGA Reballing Stencil Solder CPU IC Chip Tin Template for iPhone A8 A9 A10 A11

Description:
New patented BGA rework stencils: MJ 3D BGA Reballing Stencil template, iPhone A8 A9 A10 groove Reballing Stencil Template, iPhone X/8/8 plus, iphone 6/6 plus, iphone 6s/6s plus and iphone 7 /7plus 3D BGA Reballing Stencil template.
Feature:
New Style 3D BGA planting Stencil: Stepped groove / easy to use / Accuratea Lignment
- Stepped groove design enables stencil to align with tinning position of IC rapidly.
- The square holes design makes it easier to take out the formed solder balls.
- This 3D stencil is easy to use no matter you are a new or expert.
- High success rate of planting tin, the solder balls can be formed once after you are proficient.
- This 3D planting stencil is thicker than ordinary stencils in the market .Less tendency of deformation makes its using life be longer.
Notice:
1.The package don't include any IC.
2.Sometimes the factory update the BGA Reballing Stencil, the size maybe different, but the function is same.
3D A8: iphone 6/6 plus IC: Touch IC, Baseband, font IC, audio IC, power IC, A8 CPU
3D A9: iphone 6s/6s plus: Touch IC, Baseband, font IC, audio IC, power IC, A9 CPU
3D A10: iphone 7 /7plus: Touch IC, Baseband, font IC, audio IC, power IC, A10 CPU
3D A11: iphone X /8 /8plus: Touch IC, Baseband, font IC, audio IC, power IC, A11 CPU
Package Including: (A8 Set)
1x A8 Set 3D BGA reball stencils
Package Including: (A9 Set)
1x A9 Set 3D BGA reball stencils
Package Including: (A10 Set)
1x A10 Set 3D BGA reball stencils
Package Including: (A11 Set)
1x A11 Set 3D BGA reball stencils
Package Including: (A8 A9 A10 Set)
1x A8 Set 3D BGA reball stencils
1x A9 Set 3D BGA reball stencils
1x A10 Set 3D BGA reball stencils